Thermoelastic damping in electrostatically actuated annular microplate

In this paper، a linear model for vibration of electrostatically actuated annular microplate with In this paper، a linear model for symmetrical vibrations of electrostatically actuated annular microplate with thermoelastic damping is considered for calculating the quality factor of this damping. The Kirchhoff–Love plate theory is used to model the microplate which is coupled with thermal conduction equation one dimensionally. For calculating the Q-factors in each mode، two methods are compared with respect to linearization of frequency equation. Also the dependency of thermoelastic damping to electrostatic load and geometry of annular microplate is investigated with clamped-clamped and clamped-free boundaries. A silicon annular microplate is considered as an example. The results show that، there are a critical radius and thickness which make the thermoelastic damping to be maximal. Also the results show that the effect of electrostatic load on thermoelastic damping depends on the type of boundary conditions. The effect of electrostatic load on thermoelastic damping for clamped-free boundaries is more than for clamped-clamped boundaries.