nterparticle bond formation during sintering of Cu-10Sn-10Pb from mixed powder

In this research، interparticle bond formation in powder metallurgy Cu-10Sn-10Pb alloy from mixed powder was investigated. For this purpose Cu، Sn and Pb powders with particle size less than 100 μm were mixed according to the above weight ratio and the prepared powder was compacted at 550 MPa. The compacted samples were sintered in the range of 750 to 800°C، obtained through thermal analysis، for 60 min in Argon atmosphere. Comparing metallographic results and fracture surfaces، the amount of liquid phase، either transient or persistence، was sududied. More homogeneity، in consequence of rearrangement and diffusion of produced liquid phase، was acheived with increasing sintering temperature. Therefore the interparticle bond strength was comparable with particles strength so that transgranular fracture participates more than intergranular fracture.