Optimization of Sensitivity and Stability of Gold/Silver bi-Layer Thin Films Used in Surface Plasmon Resonance Chips

The aim of this study is experimental assay of sensitivity and stability of a bimetallic silver/gold SPR sensor chip. This chip utilizes the sensitivity of the silver and the stability of the gold. Moreover, the Silver layer (instead of usual Cr or Ti layer) was used as an adhesive intermediate layer between the Gold layer and the glass substrate. The optimization of the Gold/Silver thickness using SPR analysis and physical and chemical stability tests showed that the 20/30 gold/silver composite resulting in a better precision and more stable SPR sensing chip.