The Formation of Al3Ti Intermetallic compound at the junction interface of Titanium-Aluminum diffusional Coupling by Means of Diffusional Annealing Process

In this study, the formation of the Al3Ti intermetallic compound at the junction interface of aluminum-titanium was investigated during deposition and annealing. The results illustrated that during the deposition process, one thin layer of Ti3Al2 intermetallic compound was created at the junction interface. During the annealing at 550 °C, this layer was transformed to the Al3Ti intermetallic phase and the layer growth occurred. By performing annealing at higher temperatures, the growth rate of Al3Ti intermetallic layer was increased; at the same time, the formation of Kirkendall cavities and coupling in the cavities and fragmentation of diffusional coupling from the junction with aluminum were observed.