Experimental Investigation of the Effect of Different Parameters on the Thermal Performance of the Vapor Chamber for Cooling the Electronic Board

Nowadays with the increase of the power of electronic components, their heat generation rates have also increased therefore, therefore it is necessary to use new methods to cooling different parts. One of the solutions to cool the high-power components is the use of vapor chambers. The vapor chamber consists of three sections, the evaporation, the middle and the condensation section, which are flattened and can transfer a significant amount of heat without the need for external power and only by using a fluid phase change. In this study, two vapor chambers with a length and width of 120 mm and a height of 15 mm were made to cool the high-power printed circuit board, where the evaporation section of one of them was roughened and the condensation section is cooled down by the fin and through the air. In this research, the effect of roughening the evaporation section, the angle of the vapor chamber relative to the horizon, different heat input and the geometric deformation of the heat source in the fixed area, as well as changing the location of the heat source in the evaporation section, on the thermal performance of the vapor chamber, is experimentally reviewed and compared. The results of the experiments show that increasing the heat input and roughing the evaporation section improves the performance of the vapor chamber and the thermal resistance of the vapor chamber is also the function of changing its angle relative to the horizon, deformation, and location of the thermal source.