Investigation of applying the old corrugated container (OCC) and aspen chips in particleboard production

In this study, aspen chips with OCC (Old Corrugated Container) were used in particleboard production and samples were prepared at two different levels of resin contents (%9 and %10) and three levels of combination: 1- %25 OCC +%75 aspen, 2- %50 OCC + %50 aspen, 3- %75 OCC +%25 aspen. Indeed in this study these two mentioned factors are variable and other factors such as press temperature: 165 ºC, press time: 5 minute, mat moisture %12, board density 0.75 g/cm3 and press pressure 30 kg/cm2 were constant. After the board's fabrication according to DIN-68763 standard, different tests were undergone include: bending strength, modulus of elasticity, internal bonding strength and thickness swelling after 2 & 24 hours immersion in water. The results indicate that second ratio(%50 OCC and %50 aspen chips) is proper for bending applications and the first ratio(%25 OCC and %75 aspen chips) is proper for tensile and thickness swelling applications. Therefore, applying the OCC more than %50 in manufacturing combination; result in decreasing the physical and mechanical properties. Moreover the results show that when the resin content increases, the board features improve.