Microstructure, Mechanical, and Electrical Properties of Cu-30Zn Alloys Produced by Multi-Directional Forging

In this research, Cu-30Zn alloy was subjected to severe plastic deformation (SPD) by Multi-Directional Forging (MDF) process up to 6 passes at room temperature. After the samples fabrication, microstructure, mechanical, and electrical properties were investigated. Mechanical properties of the samples were measured by shear punch, tensile, and hardness tests at room temperature after each pass of MDF process. In addition, electrical properties of the samples were evaluated by Eddy Current method. The results of microstructure characterization by scanning electron microscopy equipped with EBSD attachment showed that the grain size of the initial annealed specimen reduced from about 230 µm to less than 1 µm, after 6 passes of MDF process. Furthermore, grain size reduction was accompanied by slip process, formation of twinning, and shear bonds in a specific direction. According to the results, mechanical properties were significantly improved after 6 passes of MDF. MDF process led to a 212% increase in hardness, enhancement of 105% and 73% in shear yield and ultimate shear strengths, and also improvement of 298% and 190% in tensile yield and ultimate tensile strengths, respectively. The results of the electrical conductivity showed that the electrical conductivity of the Cu-30Z alloy reduced slightly during the MDF process. Comparison of mechanical and electrical properties results demonstrated that high-strength alloys can be obtained in the MDF process without significantly reduction in the electrical conductivity.