In this study, Ni-Cu/Cu multilayers from a single sulfate/sulfamate bath using electrodeposition method from two solutions; ultrapure solution without impurity of Co and impure solution with 0.2 Co in galvanostat/potentiostat G/P mode was prepared at optimized Cu deposition potential. Magnetoresistance MR measurements were performed at room temperature for the Ni-Cu/Cu multilayers as a function of Cu layer thickness for both ultrapure and impure electrolytes. The magnetoresistance curves represent an anisotropic magnetoresistance AMR for multilayered samples prepared by ultrapure electrolyte and giant magnetoresistance GMR by impure electrolyte, so that the maximum GMR value was obtained for Ni-Cu/Cu multilayer with 3.0nm/4.2nm thickness. The X-ray diffraction pattern XRD was used for structural analysis of multilayer films. The XRD pattern confirmed the presence of satellite peaks, indicating the existence of a superlattice structure. The nominal thickness of the multilayers Λnominal was compared with the thickness of the X-ray diffraction pattern ΛXRD, which was significantly consistent.. The morphology of the samples was performed using scanning electron microscopy SEM which implies uniformity of deposition during the layering process. The results showed that with decreasing thickness of non magnetic layer Cu the coercivity decreased and saturation magnetization increased.
- حق عضویت دریافتی صرف حمایت از نشریات عضو و نگهداری، تکمیل و توسعه مگیران میشود.
- پرداخت حق اشتراک و دانلود مقالات اجازه بازنشر آن در سایر رسانههای چاپی و دیجیتال را به کاربر نمیدهد.