simulation of metal thin films deposition by thermal evaporation technique

Thin metal layers are of particular interest due to their wide application in the fields of solar cell, sensor, electron microscopy and spectroscopy, diagnosis and treatment of cancerous tissues, aerospace, telecommunications, lasers, automobiles, etc. In this paper, the physical vapor deposition process of aluminum Al, copper Cu, tin Sn and silver Ag functional metals is simulated and investigated by thermal evaporation using finite element method. The results showed that the type of metal has a great influence on the thickness of the thin films but the uniformity of the film thickness is independent of this parameter. Also, the variation of vapor pressure changed the thickness distribution but did not affect the uniformity of the film thickness. Finally, the deposition rate of the above metals was presented at vapor pressures of 50 and 100 Pa.