Simulation of Silver Thin Film's Growth and Influence of Deposition Rate on Final Grain Size under Angle Flux and Standard Situation

In this paper, a 2D stimulation model, FACET, is used for investigation of the relation between micro structure and deposition conditions such as substrate temperature, deposition rate and deposition angle of Ag thin films. It is observed that by increasing the deposition rate in standard conditions providing that the temperature of substrate is low, the average of final grain size is decreased. While, in deposition with angle flux the average of final grain size is increased.