Electrodeposition of Co-Cu/Cu multilayered films and the effect of growth parameters on their structures
Message:
Abstract:
Electrodeposited Co-Cu/Cu multilayered films with nano scale bilayer under different growth parameters such as deposition potential، total thickness، and electrolyte temperature were prepared from a bath of CuSO4 and CoSO4 on Ti polycrystalline with (101)، (103)، and (001) strong texture substrates. Nanostructure and morphology of the deposits were respectively studied using X-ray diffractometer and scanning electron microscope. The XRD results showed that the multilayers have fcc structure with (111) strong texture. It was found that the growth of Cu is columnar and under more negative Co deposition potential their grain size and height of the Cu column tend to be decreased. It was observed that when total thickness increases the effect of lattice mismatch between the film and substrate decreases. Finally، the surface grain size and also concentration of impurity atoms such as S relatively increase with increasing electrolyte temperature.
Language:
Persian
Published:
Iranian Journal of Surface Science and Engineering, No. 11, 2011
Pages:
67 - 75
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