Lightweight Particleboard Using Expanded Polystyrene

In this study the possibility of using expanded polystyrene (EPS) was studied to reduce the density of the final board. This research was concentrated on weight loss particleboard in significant quantities, while maintaining the internal bond strength. For this purpose, with using different values of the expanded polystyrene, along with the change of press temperature, the composites were made with a nominal thickness of 25 mm and 30% less weight, characterized by industrial production. The results that some of them are as follows were raised from analysis of the information gathered by the physical and mechanical tests (internal adhesion, modulus of rapture, modulus of elasticity, thickness swelling, water absorption and Screw-holding capacity) which were conducted in accordance with EN. Generally, removing a partial of wood particles from core layer and replacement of EPS to make available reducing weight with keeping physical characteristics was successful. The expanded polystyrene with the considering applications for this product in the first stage showed the acceptable resistance. The result of internal bonding test showed that increasing the content of foam polystyrene granules and press temperature has a negative impact on the property. The results clearly showed increasing of press temperature and EPS content caused modulus of rapture and modulus of elasticity was improved. No significant difference was found on the effect of press temperature on screw withdrawal strength while the highest of this strength was found on the panels made with 1 percent EPS contain. Particleboard made with 5 % Expanded polystyrene showed most favorable percent thickness swelling and water absorption.