Thermal Performance of Hydrophobic Vapor Chamber and the Influence of Different Parameters on It

Using vapor chambers is a useful way to control the temperature of electronic components. In this study, two vapor chambers with identical dimensions have been tested. The condensation part of one of them is hydrophobic, the second is simple and there is no hydrophobic operation. In this study, the effect of lateral surface insulation on both vapor chambers, the effect of other parameters, including vapor chamber angle with the horizon, different heat loads produced by the heat source (printed circuit board), geometric deformation of the heat source in a fixed area, and also, change the location of the heat source installation on the evaporator floor, on the thermal performance of the vapor chamber, due to the hydrophobicity of the condensation part of the vapor chamber, has been studied as experimental work and compared with the simple vapor chamber. Also, the impact of installing the heat source on the entire floor of the evaporation section, by increasing the area of it, in both vapor chambers have been investigated. Experimental results show that hydrophobicity and increase of heat, in total and in most cases, decrease the thermal resistance of the vapor chamber. The thermal performance of the vapor chamber has also been improved by installing the printed circuit board across the evaporator floor and it depends on other parameters investigated in this study. Also, insulating the side surfaces, increases the thermal resistance in the simple vapor chamber and reduces thermal resistance in the vapor chamber with the hydrophobic condensation section.