A review of studies in the field of thermal performance of the fins and heat sinks

One of the most important issues in various industries, including electronics, is Components thermal management. In order to have more powerful, integrated and smaller electronic products, it is necessary to use higher level of Heat Dissipation Technology. This requires the use of extended surfaces (fins) resolves. Many studies have been conducted to find the optimal shape of the fins. Different methods are used to optimize and increase the efficiency of the fins and heat sinks which can be noted to optimize the geometry, shape and dimensions, change the fins distance, the use of different materials in the manufacture of fins, the use of porous media with high thermal conductivity to improve fins thermal characteristics. . In this study is mentioned review of some previous researches that has been done in this context.