Prediction mechanical properties of particleboard and analysis the interaction effect of slenderness ratio and resin content, using linear, quadratic and exponential equation.

The purpose of this study was to investigate which equation (Linear, Exponential equation and quadratic) can describe exactly the interaction effect of particle size and adhesive percent and predict mechanical properties of particleboard (modulus of rupture, modulus of elasticity and bending strength). For this work three levels of density including 0.65, 0.7, and 0.75 g/cm3 and also, three levels of adhesive content including 8, 9.5, and 11% and four levels of slenderness ratio of particles including 46.35, 33.7, 21.51 and 12.87 were used. After conducting the experiment and preparing the data, three kind of equation (linear, quadratic and Exponential equation) for each mechanical property based on slenderness of particles, density and adhesive percent obtained. The result indicated there was no correlation between mechanical properties of particleboard and quadratic equation but there were good correlations between linear and Exponential equation. Also the result indicated that Exponential equation can describe efficiently the simultaneous effect of slenderness and adhesive present on the mechanical properties of particleboard, and it can predict better mechanical properties than linear equation.